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Die Bonder, Flip Chip Bonder, Wafer Ink Systems and more - AMICRA Microtechnologies - AMICRA microtechnologies

AMICRA Microtechnologies' high precision die bonder and flip chip bonders, wafer ink systems and dispense & test systems can optimize your bond process and reduce costs in back-end packaging. We offer products for the entire industry field of microelectronics, including: active optical cable, fan-out, TSV, TCB, process development, silicon photonics, semiconductor backend, fiber optic, LED, optoelectronics and MEMS.Visit our product specific pages to learn more about the customized services we can offer

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Die Bonder, Flip Chip Bonder, Wafer Ink Systems and more - AMICRA Microtechnologies - AMICRA microtechnologies | amicra.com Reviews

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AMICRA Microtechnologies' high precision die bonder and flip chip bonders, wafer ink systems and dispense & test systems can optimize your bond process and reduce costs in back-end packaging. We offer products for the entire industry field of microelectronics, including: active optical cable, fan-out, TSV, TCB, process development, silicon photonics, semiconductor backend, fiber optic, LED, optoelectronics and MEMS.Visit our product specific pages to learn more about the customized services we can offer

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1 high precision die bonder

2 high accuracy die bonder

3 epoxy die bonding

4 flip chip on lead

5 FCOL

6 automotive sensor assembly

7 die bonder

8 die bonding

9 flip chip bonder

10 flip chip bonding

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sitemap,imprint,news and jobs,amicra microtechnologies gmbh,high precision die bonder,flip chip bonder,fan out,process development,fiber optic,opto electronics,and mems,product summary,plus,nova,fanout,wafer inking sytems,lts test system,flip chip bonders

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Die Bonder, Flip Chip Bonder, Wafer Ink Systems and more - AMICRA Microtechnologies - AMICRA microtechnologies | amicra.com Reviews

https://amicra.com

AMICRA Microtechnologies' high precision die bonder and flip chip bonders, wafer ink systems and dispense & test systems can optimize your bond process and reduce costs in back-end packaging. We offer products for the entire industry field of microelectronics, including: active optical cable, fan-out, TSV, TCB, process development, silicon photonics, semiconductor backend, fiber optic, LED, optoelectronics and MEMS.Visit our product specific pages to learn more about the customized services we can offer

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amicra.com

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Company

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Active Optical Cable (AOC). Die- and Flip Chip Bonder. AFC Plus - Die Bonder and Flip Chip Bonder. Nova Plus - Die Bonder and Flip Chip Bonder. Nova Fan Out - Die Bonder and Flip Chip Bonder. AIS - Wafer Inking System. SIS - Wafer Inking System. High Speed Dispense Systems. Login to your account. More than Precision: Die Bonder / Flip Chip Bonder Systems - Dispense and Test Systems - Wafer Inking Solutions and more! Our earned expertise and experience allows. Development of prototype sytems. Tab above to...

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http://www.amicra.com/products/dispense-test-systems/silicone-gel-dispense-line.html

Active Optical Cable (AOC). Die- and Flip Chip Bonder. AFC Plus - Die Bonder and Flip Chip Bonder. Nova Plus - Die Bonder and Flip Chip Bonder. Nova Fan Out - Die Bonder and Flip Chip Bonder. AIS - Wafer Inking System. SIS - Wafer Inking System. High Speed Dispense Systems. Login to your account. Old or invalid link. Is therefore possible that. Links are no longer assigned. Which is why you have landed on. Can be found on. To the start site. 49 941 208209 0 ask our experts.

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Active Optical Cable (AOC). Die- and Flip Chip Bonder. AFC Plus - Die Bonder and Flip Chip Bonder. Nova Plus - Die Bonder and Flip Chip Bonder. Nova Fan Out - Die Bonder and Flip Chip Bonder. AIS - Wafer Inking System. SIS - Wafer Inking System. High Speed Dispense Systems. Login to your account. Commercial Register at Amtsgericht Regensburg, HRB 8178. Taxpayer Identification Number DE 813229492. 49 (941) 208209 -0 (Switchboard). 49 (941) 208-209-80 (for the Press and Sales).

4

AIS - Wafer Inking System

http://www.amicra.com/products/wafer-ink-systems/ais-wafer-inking-system.html

Active Optical Cable (AOC). Die- and Flip Chip Bonder. AFC Plus - Die Bonder and Flip Chip Bonder. Nova Plus - Die Bonder and Flip Chip Bonder. Nova Fan Out - Die Bonder and Flip Chip Bonder. AIS - Wafer Inking System. SIS - Wafer Inking System. High Speed Dispense Systems. Login to your account. AIS - Wafer Inking System. AMICRA's AIS fully automatic, high-speed ink system is for inking diced and undiced wafers (up to 20 dots/s) with a dot size down to 70 µm. Up to 3 inking units. Dot size down to 70 µm.

5

Nova Fan Out - Die Bonder and Flip Chip Bonder

http://www.amicra.com/products/die-flip-chip-bonder/nova-fanout-die-bonder-and-flip-chip-bonder.html

Active Optical Cable (AOC). Die- and Flip Chip Bonder. AFC Plus - Die Bonder and Flip Chip Bonder. Nova Plus - Die Bonder and Flip Chip Bonder. Nova Fan Out - Die Bonder and Flip Chip Bonder. AIS - Wafer Inking System. SIS - Wafer Inking System. High Speed Dispense Systems. Login to your account. Nova Fan Out - Die Bonder and Flip Chip Bonder. AMICRA's optimal die bonding machine for the fanout process. Die Bonder / Flip Chip Bonder has a wide range of features including the following:. Supports special ...

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Exhibitor Directory | ECOC 2016

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Hotels, Travel and Venue. Why exhibit at ECOC. Why visit ECOC Exhibition. Hotels, Travel and Venue. 18-22 SEPT DÜSSELDORF GERMANY. Connectors and patch cords. Design and manufacturing services (inc.software). Fibre and fibre-optic cable. Fibre management and enclosures. Free space optical systems. Laser sources and subassemblies. Optical amplifiers and gain blocks. Optical subsystems (muxponders, regenerators, etc.). Passives (attenuators, circulators, isolators, splitters, couplers, etc.). Published thr...

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IWLPC - International Wafer Level Packaging Conference

http://www.iwlpc.com/exhibitor_info.cfm

Bridging the Interconnect Gap. October 18 - 20, 2016. San Jose, California, USA. Sponsor or Exhibit Today! View available Sponsorship and Exhibitor Opportunities. Dates: October 18-19, 2016. Location: DoubleTree by Hilton Hotel, San Jose, CA. October 19: 9:30am-3:30 pm. Why Exhibit at IWLPC? A focused international audience. In this highly competitive marketplace. And concepts to the market. With existing customers and generate new leads. View the latest floor plan. Two Free Lunches Per Day. 8' D x 10' W).

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S-REFIT AG - Portfoliokarte

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Produkte zur Behandlung von Krankheiten. Produkte zur Diagnose von aktiven Infektions- und Autoimmunerkrankungen. Blue Cell Networks GmbH. IISY Intelligente Informationssysteme AG. Mischsysteme für flüssige Medien. Sommer Metall-Stahlbau GmbH and Co. KG. 95182 Döhlau bei Hof/Saale. Fassadensysteme, Stahlbau, Sicherheitstechnik. Therapiegerät für neurobiologische Krankheitszustände. S-REFIT AG - regionaler Finanzierungsfonds für Innovationen und Technologieunternehmen.

moosprojectviewer.com

Customers for MOOS Project Viewer

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Microsoft and Microsoft Project are registered trademarks of Microsoft Corporation. This website, MOOS Project Viewer, and Stand By Soft are not affiliated with Microsoft Corporation.

iwlpc.com

IWLPC - International Wafer Level Packaging Conference

http://www.iwlpc.com/expo.cfm

Bridging the Interconnect Gap. October 18 - 20, 2016. San Jose, California, USA. Exhibition: October 18-19, 2016. DoubleTree by Hilton Hotel, San Jose, CA. October 19: 9:30am-5:30 pm. AI Technology, Inc. Applied Materials, Inc. ASM LASER SEPARATION INTERNATIONAL. Carl Zeiss Microscopy, LLC. Conductive Containers, Inc. Cyber technologies USA, LLC. FlipChip International - Huatian. Grinding and Dicing Services Inc. Hitachi Chemical Co., Ltd. Lintec of America, Inc. Nikon Metrology, Inc. SHENMAO America, Inc.

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http://paitech.co.il/semicon_nano.html

Where service comes first. Over 20 years of personal contact with. The Israeli Life-Science and Nano community. Design, development and manufacture of wet surface treatment equipment (until 100L Volume), wet surface treatment testing equipment, wet surface treatment analyzers (excluding coating application) Design, development and manufacture of wet surface treatment-related products (equipment/chemicals). OAI is a Silicon Valley-based manufacturer of advanced precision equipment for the Semiconductor, M...

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Die Bonder, Flip Chip Bonder, Wafer Ink Systems and more - AMICRA Microtechnologies - AMICRA microtechnologies

Highest accuracy micro assembly solutions. Best in class fully automatic wafer ink systems. Highest flexibility for customization. Die Bonder/Flip Chip Bonders, Wafer Inking Systems, and Dispensing and Test Sytems. We provide customers with extraordinary, high-technological engineering services, specializing in the latest. Technology, wafer inking systems, dispense and test systems as well as products for the entire industry field of microelectronics, including: active optical cable. San Diego, California.

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