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Texas Specialty Veterinary Services | Justin Harper DVM | Texas ...
Justin Harper, owner and surgeon of in-house veterinary surgery service that provides select surgical services for veterinary practitioners and their clients.Texas ...
http://tsvs.net/
Toronto Spartan Volleyball League
Registration for the Winter 2012 season of the recreational division of the TSVL is now closed. If you would like to be added to our waiting list, please contact John ...
http://tsvl.org/
TSVL.NET 'My KinGDoM'
TSVL.NET 'My KinGDoM' ALL YOUR PHOTO HERE! Contact us/ info@tsvl.net
http://tsvl.net/
About Justin Harper | Veterinary Surgical Services | Texas Hill ...
At TSVS, we aim to provide practical alternatives for your clients who can’t afford routine referral or need additional options for their pet’s surgical problems.
http://www.tsvs.net/js/about/
Tournaments | Toronto Spartan Volleyball League
Not getting enough volleyball? Try playing in a tournament! The TSVL has tournaments for both competitive and recreational levels. Additionally, the annual Rise of ...
http://tsvl.org/tournaments
IBM, Micron to build hybrid memory with TSVs
12/5/2011 1:40 AM EST. Have seen a few things from Amkor on memory cubes using TSVs. I wonder how much ... More...
http://www.eetimes.com/electronics-news/4231051/IBM--Micron-to-build-hybrid-memory-with-TSVs
TSVs, beyond-CMOS top IITC-MAM "must see" lists for conference ...
By Debra Vogler, senior technical editor. May 4, 2011-- Anticipating a lively discussion at this year's combined IITC-MAM conference (May 9-12, 2011, Dresden, Germany ...
http://citrix.cleanrooms.com/index/display/article-display/7066794730/articles/solid-state-technology/semiconductors/device-architecture/interconnects/2011/5/tsvs_-beyond-cmos.html
Synthetic Vision System | TSVS | 3-D Spatial Awareness ...
To help streamline the display of complex tactical information for today’s air crews, ENSCO, Inc., developed the Tactical Synthetic Vision System (TSVS) to ...
http://www.ensco.com/index.cfm?page=691
and Requirements - A Closer Look at 3D ICS with TSVS
Introduction . As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up – to 3D ICs with through ...
http://www.cadence.com/rl/Resources/white_papers/3DIC_wp.pdf
GlobalFoundries installs gear for 20-nm TSVs
GlobalFoundries installs gear for 20nm TSVs ... 4/30/2012 6:09 PM EDT @Rick Merritt: the title of the article is misleading -20nm TSV's!
http://www.eetimes.com/electronics-news/4371752/GlobalFoundries-installs-gear-for-20nm-TSVs

News Results

Separate The Hype From The Reality In 3D-ICs
Through-silicon vias (TSVs) within the silicon interposer are used to route power and signals from the underlying substrate (such as a printed-circuit board), through the silicon substrate to the metal layers of the interposer, which then ...
electronicdesign.com
Japanese team boosts NAND flash durability and performance with ReRAM buffer
The researchers designed their prototype by assuming the use of TSVs (through-silicon vias) but believe the design could be adapted to other approaches currently in mass production. TSVs have been demoed and are under development, but aren’t yet shipping ...
Extreme Tech
3D and 2.5D semiconductor packaging technologies @ The ConFab
The device combines a 28nm active die and 65nm passive interposer. Microbumps and TSVs are implemented in a low-risk process, and the silicon interposer reduced stress with low-k materials. The benefits to capacity, bandwidth, and power were clear.
ElectroIQ
20 nm Chips, 3D ICs, Low Power and Fast Tools Are Themes Of DAC 2012
Cadence 3D-IC technology fosters multi-chip co-design between digital, custom and package environments, incorporating through-silicon vias (TSVs) on both chips and silicon carriers. It also supports micro-bump alignment, placement, routing and ...
electronicdesign.com
Research and Markets: Reverse Costing Report - Nemotek Wafer-Level Camera Shellcase MVP Wafer-Level Package - OptiMLTM Wafer-Level Optics
Both technologies are licensed by Tessera. The wafer-level packaging of the CIS is realized with the Shellcase MVP process, using TSVs to connect the bond pads on the die and the BGA interface on the rear face of the package. The wafer-level ...
Boston Globe
ECTC’s packaging themes cover OSAT capex, power electronics and LEDS, collaboration, more
There was plenty of that to be found in the main and additional sessions. Also read: ECTC: Focus on 3D integration and TSVs A special session was held on Tuesday morning, titled “Next-Generation Packaging and Integration: The Transformed Role of the ...
ElectroIQ
Will MEMS devices ever be the stars of the show?
Silex has been using interposers since 2006. "The interposer handles the tsvs and has bumps, so it can be mounted directly on a pcb," Himes added. Like many other technologies, MEMS is being pushed by the mobile phone sector. "MEMS devices are smaller ...
New Electronics
28nm is fabulous for Xilinx, says Gavrielov.
The Virtex 7 has16 28Gbps transceivers and 72 13.1Gbps transceivers. The die sit side by side on an interposer connected by TSVs. “It has much higher bandwidth than you can achieve with an FPGA,” says Gavrielov. Xilinx’s high hopes for the 3D part ...
ElectronicsWeekly.com
Out on safari at ECTC
Capital expenditures are going up by an order of a magnitude with TSVs in the equation, making it difficult for OSATs to fund their own growth. The need for collaboration was brought up not only here, but in many other conference sessions as well.
globalsmt.net
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