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PCB Design and Fabrication Institute » Blog Archive Generic PCB Fabrication Process | pcbdesignschool.com
http://www.pcbdesignschool.com/2009/10/04/generic-pcb-fabrication-process
PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Laquo; The Fabrication Process. Data Preparation: Data Formats. Generic PCB Fabrication Process. The steps required to build a standard printed circuit board are numerous. I shall start by itemizing the steps. I shall then document each one in greater detail as we go. The generic fabrication steps are as follows…. PEP (Post Etch Punch). AOI (Automatic Optical Inspection) Inner layers. Sorry for b...
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PCB Design and Fabrication Institute 02 Material Allocation | pcbdesignschool.com
http://www.pcbdesignschool.com/category/fabrication-process/material-allocation
PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Archive for the ‘02 Material Allocation’ Category. Wednesday, April 27th, 2011. What does it take to build a circuit board? Base laminate is typically copper clad FR4. FR4 is a composite material consisting of (more…). Posted in 02 Material Allocation. Subscribe in a reader. What do you prefer for a final solderable finish on your printed circuit boards? Printed Circuit Design and Fabrication.
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PCB Design and Fabrication Institute » Blog Archive When ENIG Doesn't Solder | pcbdesignschool.com
http://www.pcbdesignschool.com/2012/11/25/when-enig-doesnt-solder
PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Laquo; Compliance Requirements for 2013. Simple Yield Improvement. (Part 1). When ENIG Doesn’t Solder. One of the misconceptions about E. If gold is a noble metal why is the shelf life only 6 months? To appreciate why ENIG has a shelf life of 6 months you need to understand how the gold surface interacts with the nickel surface. The IPC-4552 specification is the industry guide for ENIG and is...
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PCB Design and Fabrication Institute 04 Dry Film Lamination | pcbdesignschool.com
http://www.pcbdesignschool.com/category/fabrication-process/04-dry-film-lamination
PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Archive for the ‘04 Dry Film Lamination’ Category. Dry Film Lamination (history). Sunday, September 23rd, 2012. Posted in 04 Dry Film Lamination. Subscribe in a reader. What do you prefer for a final solderable finish on your printed circuit boards? Printed Circuit Design and Fabrication. Simple Yield Improvement. (Part 2). Simple Yield Improvement. (Part 1). When ENIG Doesn’t Solder.
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PCB Design and Fabrication Institute 01 Data Preparation | pcbdesignschool.com
http://www.pcbdesignschool.com/category/fabrication-process/data-preparation
PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Archive for the ‘01 Data Preparation’ Category. Sunday, February 10th, 2013. An etch factor or etch compensation is a process modification made by the. Etch factor added with CAM tool. Posted in 01 Data Preparation. Data Preparation: Front End Engineering. Sunday, November 21st, 2010. Posted in 01 Data Preparation. Data Preparation: Data Formats. Sunday, December 13th, 2009. Subscribe in a reader.
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PCB Design and Fabrication Institute Related sites on the web. | pcbdesignschool.com
http://www.pcbdesignschool.com/related-sites-on-the-web
PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Related sites on the web. Written by: David Duross. On April 27, 2010. On June 24, 2012. In keeping with the theme of this blog, I’ve included a list of links to points of interest related to printed circuit boards. Association Connecting Electronics Industries (IPC). Defense Supply Center Columbus (DSCC/MIL Spec). Links of interest…. How to be a Circuit Board Designer. Subscribe in a reader.
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PCB Design and Fabrication Institute » Blog Archive Etch Factor | pcbdesignschool.com
http://www.pcbdesignschool.com/2013/02/10/etch-factor
PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Laquo; Simple Yield Improvement. (Part 2). An etch factor or etch compensation is a process modification made by the. Etch factor added with CAM tool. 1) Copper feature to copper feature. This includes line to line, Line to pad and pad to pad only. Copper Design Etch Min Mfg. Min Space. Wt Line Width Factor Space in the design. Oz 004 .001 .004 .005. 1 Oz 005 .002 .004 .006. With regards to Item ...
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PCB Design and Fabrication Institute Site Map | pcbdesignschool.com
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PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. On January 3, 2009. Last revised by: David Duross. June 24, 2012. Page 1 of 2 : Next Page. What damage does the assembly process do to a pcb? What damage does the assembly process do to a pcb? What damage does the assembly process do to a pcb? What damage does the assembly process do to a pcb? What damage does the assembly process do to a pcb? What damage does the assembly process do to a pcb?
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PCB Design and Fabrication Institute » Blog Archive Simple Yield Improvement | pcbdesignschool.com
http://www.pcbdesignschool.com/2013/01/06/simple-yield-improvement-part-2
PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Laquo; Simple Yield Improvement. (Part 1). Simple Yield Improvement. (Part 2). In the previous post we discussed what happens to the printed circuit board structure when it is heated. We discussed how different materials expand at different rates and the effect the expansion rates have on the warp and twist of a. In this post we shall discuss the stabilizing effect that. The size of the BGA.
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