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3D-MID's Blog | Laser Direct Structured (LDS) and Two-Shot 3-Dimensional Molded Interconnect Devices provided by www.SelectConnectTech.com

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3D-MID's Blog | Laser Direct Structured (LDS) and Two-Shot 3-Dimensional Molded Interconnect Devices provided by www.SelectConnectTech.com | 3dmid.wordpress.com Reviews

https://3dmid.wordpress.com

Laser Direct Structured (LDS) and Two-Shot 3-Dimensional Molded Interconnect Devices provided by www.SelectConnectTech.com (by APC Chrome)

INTERNAL PAGES

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QR Code SCT | 3D-MID's Blog

https://3dmid.wordpress.com/2011/11/28/costs-of-lds/qr-code-sct

Laser Direct Structured (LDS) and Two-Shot 3-Dimensional Molded Interconnect Devices provided by www.SelectConnectTech.com. Raquo; QR Code SCT. November 28, 2011. Leave a Reply Cancel reply. Enter your comment here. Please log in using one of these methods to post your comment:. Address never made public). You are commenting using your WordPress.com account. ( Log Out. You are commenting using your Twitter account. ( Log Out. You are commenting using your Facebook account. ( Log Out. Register Now - FREE.

2

3D MIDs and Peanut Butter Cups | 3D-MID's Blog

https://3dmid.wordpress.com/2012/02/14/3d-mids-and-peanut-butter-cups

Laser Direct Structured (LDS) and Two-Shot 3-Dimensional Molded Interconnect Devices provided by www.SelectConnectTech.com. Medical device and security shield three-dimensional molded interconnect device. 3D MIDs and Peanut Butter Cups. February 14, 2012. What can we learn about 3D MIDs from Peanut Butter Cups? But first lets go back to our childhood and look at the infamous Reese’s Peanut Butter Cup commercial. You know the one that shows how it all started. 8220;Your chocolates in my peanut butter!

3

How To Select The Proper LDS Material? | 3D-MID's Blog

https://3dmid.wordpress.com/2012/02/20/how-to-select-the-proper-lds-material

Laser Direct Structured (LDS) and Two-Shot 3-Dimensional Molded Interconnect Devices provided by www.SelectConnectTech.com. Medical device and security shield three-dimensional molded interconnect device. How To Select The Proper LDS Material? February 20, 2012. Solderability (including laser or supersonic welding). PA6/6T (semi-aromatic polyamide), based on Ultramid. Very high thermal shape stability, suitable for reflow soldering (also with lead-free solder). Very good mechanical properties. PC/ABS (po...

4

LDS Antenna | 3D-MID's Blog

https://3dmid.wordpress.com/2010/12/15/3d-mid-use-forecast-to-grow-exponentially/antenne-fur-handy

Laser Direct Structured (LDS) and Two-Shot 3-Dimensional Molded Interconnect Devices provided by www.SelectConnectTech.com. 3D-MID Use Forecast to Grow Exponentially. Raquo; LDS Antenna. December 15, 2010. Leave a Reply Cancel reply. Enter your comment here. Please log in using one of these methods to post your comment:. Address never made public). You are commenting using your WordPress.com account. ( Log Out. You are commenting using your Twitter account. ( Log Out. Notify me of new comments via email.

5

3D-MID's Blog | Laser Direct Structured (LDS) and Two-Shot 3-Dimensional Molded Interconnect Devices provided by www.SelectConnectTech.com | Page 2

https://3dmid.wordpress.com/page/2

Laser Direct Structured (LDS) and Two-Shot 3-Dimensional Molded Interconnect Devices provided by www.SelectConnectTech.com. January 16, 2012. What’s Your Why? Why do you do what you do? Why should I care? Watch this video clip from Simon Sinek. In it he explains why some leaders, brands, etc attract fanatic followers and others don’t. So sit back get some coffee and spend the next few minutes with us. Then let us know your why? You can leave it in the comments section. Let others learn from you. As the o...

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pcbdesignschool.com pcbdesignschool.com

PCB Design and Fabrication Institute » Blog Archive Generic PCB Fabrication Process | pcbdesignschool.com

http://www.pcbdesignschool.com/2009/10/04/generic-pcb-fabrication-process

PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Laquo; The Fabrication Process. Data Preparation: Data Formats. Generic PCB Fabrication Process. The steps required to build a standard printed circuit board are numerous. I shall start by itemizing the steps. I shall then document each one in greater detail as we go. The generic fabrication steps are as follows…. PEP (Post Etch Punch). AOI (Automatic Optical Inspection) Inner layers. Sorry for b...

pcbdesignschool.com pcbdesignschool.com

PCB Design and Fabrication Institute 02 Material Allocation | pcbdesignschool.com

http://www.pcbdesignschool.com/category/fabrication-process/material-allocation

PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Archive for the ‘02 Material Allocation’ Category. Wednesday, April 27th, 2011. What does it take to build a circuit board? Base laminate is typically copper clad FR4. FR4 is a composite material consisting of (more…). Posted in 02 Material Allocation. Subscribe in a reader. What do you prefer for a final solderable finish on your printed circuit boards? Printed Circuit Design and Fabrication.

pcbdesignschool.com pcbdesignschool.com

PCB Design and Fabrication Institute » Blog Archive When ENIG Doesn't Solder | pcbdesignschool.com

http://www.pcbdesignschool.com/2012/11/25/when-enig-doesnt-solder

PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Laquo; Compliance Requirements for 2013. Simple Yield Improvement. (Part 1). When ENIG Doesn’t Solder. One of the misconceptions about E. If gold is a noble metal why is the shelf life only 6 months? To appreciate why ENIG has a shelf life of 6 months you need to understand how the gold surface interacts with the nickel surface. The IPC-4552 specification is the industry guide for ENIG and is...

pcbdesignschool.com pcbdesignschool.com

PCB Design and Fabrication Institute 04 Dry Film Lamination | pcbdesignschool.com

http://www.pcbdesignschool.com/category/fabrication-process/04-dry-film-lamination

PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Archive for the ‘04 Dry Film Lamination’ Category. Dry Film Lamination (history). Sunday, September 23rd, 2012. Posted in 04 Dry Film Lamination. Subscribe in a reader. What do you prefer for a final solderable finish on your printed circuit boards? Printed Circuit Design and Fabrication. Simple Yield Improvement. (Part 2). Simple Yield Improvement. (Part 1). When ENIG Doesn’t Solder.

pcbdesignschool.com pcbdesignschool.com

PCB Design and Fabrication Institute 01 Data Preparation | pcbdesignschool.com

http://www.pcbdesignschool.com/category/fabrication-process/data-preparation

PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Archive for the ‘01 Data Preparation’ Category. Sunday, February 10th, 2013. An etch factor or etch compensation is a process modification made by the. Etch factor added with CAM tool. Posted in 01 Data Preparation. Data Preparation: Front End Engineering. Sunday, November 21st, 2010. Posted in 01 Data Preparation. Data Preparation: Data Formats. Sunday, December 13th, 2009. Subscribe in a reader.

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PCB Design and Fabrication Institute Related sites on the web. | pcbdesignschool.com

http://www.pcbdesignschool.com/related-sites-on-the-web

PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Related sites on the web. Written by: David Duross. On April 27, 2010. On June 24, 2012. In keeping with the theme of this blog, I’ve included a list of links to points of interest related to printed circuit boards. Association Connecting Electronics Industries (IPC). Defense Supply Center Columbus (DSCC/MIL Spec). Links of interest…. How to be a Circuit Board Designer. Subscribe in a reader.

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PCB Design and Fabrication Institute » Blog Archive Etch Factor | pcbdesignschool.com

http://www.pcbdesignschool.com/2013/02/10/etch-factor

PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Laquo; Simple Yield Improvement. (Part 2). An etch factor or etch compensation is a process modification made by the. Etch factor added with CAM tool. 1) Copper feature to copper feature. This includes line to line, Line to pad and pad to pad only. Copper Design Etch Min Mfg. Min Space. Wt Line Width Factor Space in the design. Oz 004 .001 .004 .005. 1 Oz 005 .002 .004 .006. With regards to Item ...

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PCB Design and Fabrication Institute Site Map | pcbdesignschool.com

http://www.pcbdesignschool.com/site-map

PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. On January 3, 2009. Last revised by: David Duross. June 24, 2012. Page 1 of 2 : Next Page. What damage does the assembly process do to a pcb? What damage does the assembly process do to a pcb? What damage does the assembly process do to a pcb? What damage does the assembly process do to a pcb? What damage does the assembly process do to a pcb? What damage does the assembly process do to a pcb?

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PCB Design and Fabrication Institute » Blog Archive Simple Yield Improvement | pcbdesignschool.com

http://www.pcbdesignschool.com/2013/01/06/simple-yield-improvement-part-2

PCB Design and Fabrication Institute. A beginner's guide to printed circuit boards. Related sites on the web. Laquo; Simple Yield Improvement. (Part 1). Simple Yield Improvement. (Part 2). In the previous post we discussed what happens to the printed circuit board structure when it is heated. We discussed how different materials expand at different rates and the effect the expansion rates have on the warp and twist of a. In this post we shall discuss the stabilizing effect that. The size of the BGA.

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3D-MID's Blog | Laser Direct Structured (LDS) and Two-Shot 3-Dimensional Molded Interconnect Devices provided by www.SelectConnectTech.com

Laser Direct Structured (LDS) and Two-Shot 3-Dimensional Molded Interconnect Devices provided by www.SelectConnectTech.com. March 6, 2012. 3d-MID’s blog has moved. We are now SelectConnectTech. Come over and subscribe at our new location. I know you don’t want to miss a post! February 27, 2012. LDS vs. 2-Shot. This saves you both time and money. The biggest advantage of LDS over 2-shot is the separation of the processes and therefore electrical comes in much later in the design phase. But with LDS the st...

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