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Chip-packing | chippacking.blogspot.com Reviews
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Chip-packing | chippacking.blogspot.com Reviews

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Semi conductor packaging reliability thermal micro fluid

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1

Thermal Considerations. | Chip-packing

http://chippacking.blogspot.com/p/thermal-considerations.html

Semi conductor packaging, micro-electric packaging. The field of electronic packaging continues to grow at an amazing rate. The electronic packaging engineer requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis may change from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on thermal design. Modes of Heat Transfer. Radia...

2

4/24/11 - 5/1/11 | Chip-packing

http://chippacking.blogspot.com/2011_04_24_archive.html

Semi conductor packaging, micro-electric packaging. Thursday, April 28, 2011. Cascade Microtech Partners with imec for 3D-TSV Probe Solutions. Technology leaders collaborate on 3D-TSV test infrastructure. About Cascade Microtech, Inc. FOR MORE INFORMATION, CONTACT:. Laurie A. Winton. Cascade Microtech, Inc. 32 16 281 880. Posted by The machinist. Links to this post. IC packaging report covers 12 package types bare die, SATS providers - Advanced Packaging. In a separate chapter, the package types are roll...

3

Cascade Microtech Partners with imec for 3D-TSV Probe Solutions | Chip-packing

http://chippacking.blogspot.com/2011/04/cascade-microtech-partners-with-imec.html

Semi conductor packaging, micro-electric packaging. Thursday, April 28, 2011. Cascade Microtech Partners with imec for 3D-TSV Probe Solutions. Technology leaders collaborate on 3D-TSV test infrastructure. About Cascade Microtech, Inc. FOR MORE INFORMATION, CONTACT:. Laurie A. Winton. Cascade Microtech, Inc. 32 16 281 880. Posted by The machinist. Cascade Microtech Partners with imec for 3D-TSV Pr. IC packaging report covers 12 package types bare. Beyond ball shear test: Microprobing chip/package .

4

Electronic Digital Convergence | Chip-packing

http://chippacking.blogspot.com/2011/04/electronic-digital-convergence.html

Semi conductor packaging, micro-electric packaging. Wednesday, April 27, 2011. The five major system technologies for electronic digital convergence. System-on-board (SOB). Discrete components interconnected on system boards. System-on-chip (SOC). Partial system on a single IC with two or more. Multichip module (MCM). Package-enabled horizontal or 2D integration of two. Or more ICs for high electrical system performance. Stacked ICs and packages (SIP). Package-enabled 3D stacking of two or more. Hence, a...

5

3D Packaging | Chip-packing

http://chippacking.blogspot.com/p/3d-packaging.html

Semi conductor packaging, micro-electric packaging. In both architectures, the interconnection is effectively 2-D. With the rapid growth in portable consumer electronics, most notably the cell phone, the need to decrease size and weight while increasing functionality has been driving the electronics industry to widespread use of die and package stacking. Many approaches have recently been developed for die and package stacking. Irvine Sensors has developed technology to process existing packages into thi...

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Chip-packing

Semi conductor packaging, micro-electric packaging. Wednesday, May 4, 2011. Intel 22nm 3-D Tri-Gate Transistor Technology. The vertical fins of Intel’s revolutionary tri-gate transistors passing through the gates. New Transistors for 22 Nanometer Chips Have an Unprecedented Combination of Power Savings and Performance Gains. Intel announces a major technical breakthrough and historic innovation in microprocessors: the world's first 3-D transistors, called Tri-Gate, in a production technology. The three-d...

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