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ELECTRONICS MEMS & NANOELECTRONICS SYSTEMS PACKAGING CENTER

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ELECTRONICS MEMS & NANOELECTRONICS SYSTEMS PACKAGING CENTER | emnspc.uta.edu Reviews

https://emnspc.uta.edu

EMNSPC, electronic packaging, mems packaging, uta, packaging,

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1

ELECTRONICS MEMS & NANOELECTRONICS SYSTEMS PACKAGING CENTER

http://emnspc.uta.edu/Director.html

Professor Agonafer joined IBM in June 1984 after receiving a PhD from Howard University. He has quickly been recognized as a leader in his field as demonstrated by the numerous leadership roles that he has taken in electronic cooling and packaging. He currently advises 18 graduate students (6 PhD's and 12MSc students). Recently, he has organized a number of NSF sponsored workshops entitled Grand Challenges of Thermal management of Electronics: Devices to Systems. Box 19018, 500 W. First Street.

2

ELECTRONICS MEMS & NANOELECTRONICS SYSTEMS PACKAGING CENTER

http://emnspc.uta.edu/Alumni.html

Name: Despande, Abhishek. Thesis Title: Birth-to-death Modeling Methodology for the Optimization of Custom Board-Level Reliability, Semiconductor Research Corporation/Texas Instruments, GRC Task 2512.001. Year: 2014 Degree: M.S. Name: Khan. Hassaan Ahmad. Thesis Title: “Experimental and Simulation Board Level Reliability Assessment of Wafer Level Chip Scale Packages (WCSPs) Under Thermal Cycling”. Year: 2014 Degree: M.S. Name: Raghunathan, R. Thesis Title: “Experimental Study On The Effect. Name: Joshi, P.

3

ELECTRONICS MEMS & NANOELECTRONICS SYSTEMS PACKAGING CENTER

http://emnspc.uta.edu/index.html

Coordinator III - Special Programs. Coordinator III - Special Programs. Dr Agonafer Wins IBM Faculty Award. Graduate students presented their work at InterPACK 2013, San Francisco,CA. The UTA Data Center Lab nears completion thanks to generous donations by The Bick Group, SealCo, Facebook, Panduit, and Yahoo! Concentration effect of Sulfur dioxide (SO2) on the corrosion rate of Silver and Copper coupons in a controlled environment. Agonafer Named Jenkins Garrett Professor. Fridays at 4.00 pm.

4

ELECTRONICS MEMS & NANOELECTRONICS SYSTEMS PACKAGING CENTER

http://emnspc.uta.edu/EMNSPC_Facilities.htm

Box 19018, 500 W. First Street. RM 211, Woolf Hall. Arlington, Texas 76019-0018. Admin Office Tel: 817- 272-7371. The University of Texas at Arlington. Mechanical and Aerospace Engineering.

5

ELECTRONICS MEMS & NANOELECTRONICS SYSTEMS PACKAGING CENTER

http://emnspc.uta.edu/emnspc_links.htm

Conferences and Societies :. IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A. Heat Sink Companies :. Metal Forming Industries, Inc. Eastern Alloys (Zinc Alloy Die-Cast Heat Sinks). AOS Thermal Compounds Heat Pipes. Thermo Electric Generators Inc. Bob Willis Surface Mount Technology. Box 19018, 500 W. First Street. RM 211, Woolf Hall. Arlington, Texas 76019-0018. Admin Office Tel: 817- 272-7371. The University of Texas at Arlington. Mechanical and Aerospace Engineering.

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ELECTRONICS MEMS & NANOELECTRONICS SYSTEMS PACKAGING CENTER

Coordinator III - Special Programs. Coordinator III - Special Programs. Dr Agonafer Wins IBM Faculty Award. Graduate students presented their work at InterPACK 2013, San Francisco,CA. The UTA Data Center Lab nears completion thanks to generous donations by The Bick Group, SealCo, Facebook, Panduit, and Yahoo! Concentration effect of Sulfur dioxide (SO2) on the corrosion rate of Silver and Copper coupons in a controlled environment. Agonafer Named Jenkins Garrett Professor. Fridays at 4.00 pm.

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