sixsigmaservices.com
Six Sigma: Certifications
http://www.sixsigmaservices.com/certifications.asp
AS9100C and ISO 9001:2008 Certified. Full QML-Q, V and Y Certification/Qualification. DLA QML Class Q, V, and Y certified for column attach and hot solder dip, a subset of assembly services. Military and Industry Standards Compliance. SIX SIGMA also operates in compliance with the following standards:. SAE AS9003, Inspection and Test Quality System. JESD625, Requirements for Handling ESD Sensitive Devices. ANSI/NCSL Z540, Calibration Laboratories and Measuring and Test Equipment. Dun and Bradstreet (DUNS).
biomems2013.com
Sponsors | BioMEMS 2013 - Biomedical MEMS and Sensors Conference
http://www.biomems2013.com/sponsors.html
Sponsorships for BioMEMS 2013 are available. For further information and questions about sponsorships, please click here. Http:/ www.roguevalleymicro.com. TSpecializing in MEMS and biomedical device fabrication, Rogue Valley Microdevices is a full service MEMS foundry that combines state-of-the-art process modules with the engineering experience and expertise to seamlessly go from custom design to device manufacturing. With our extensive list of process capabilities, all front-end processing is perfo...
promex-ind.com
Promex Industries
http://www.promex-ind.com/knowledge.html
Invited Talks and Papers. THE QFN PLATFORM - CHIP PACKAGING FOUNDATION. TUT: FABRICATING OVERMOLDED QFN PACKAGES. EMS PROTOTYPE TO MANUFACTURING TRANSITION. Technical Bulletins and Articles. OPEN CAVITY QFN TECHNICAL BULLETIN. IC PACKAGING TECHNICAL BULLETIN. INVITED TALKS and PAPERS. TECHNICAL BULLETINS and ARTICLES.
solderdip.com
Six Sigma: Certifications
http://www.solderdip.com/certifications.asp
AS9100C and ISO 9001:2008 Certified. Full QML-Q, V and Y Certification/Qualification. DLA QML Class Q, V, and Y certified for column attach and hot solder dip, a subset of assembly services. Military and Industry Standards Compliance. SIX SIGMA also operates in compliance with the following standards:. SAE AS9003, Inspection and Test Quality System. JESD625, Requirements for Handling ESD Sensitive Devices. ANSI/NCSL Z540, Calibration Laboratories and Measuring and Test Equipment. Dun and Bradstreet (DUNS).
iwlpc.com
IWLPC - International Wafer Level Packaging Conference
http://www.iwlpc.com/call_for_papers.cfm
Bridging the Interconnect Gap. October 18 - 20, 2016. San Jose, California, USA. International Wafer-Level Packaging Conference. The SMTA and Chip Scale Review. Are pleased to announce plans for the 13th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product ap...New M...
hotsolderdipping.com
Six Sigma: Certifications
http://www.hotsolderdipping.com/certifications.asp
AS9100C and ISO 9001:2008 Certified. Full QML-Q, V and Y Certification/Qualification. DLA QML Class Q, V, and Y certified for column attach and hot solder dip, a subset of assembly services. Military and Industry Standards Compliance. SIX SIGMA also operates in compliance with the following standards:. SAE AS9003, Inspection and Test Quality System. JESD625, Requirements for Handling ESD Sensitive Devices. ANSI/NCSL Z540, Calibration Laboratories and Measuring and Test Equipment. Dun and Bradstreet (DUNS).
3dasip.org
Sponsors | 3D ASIP
http://3dasip.org/Sponsors.html
3D Architectures for Semiconductor Integration and Packaging. Sponsor and exhibitor opportunities are still available, but space is limited and sells out every year. For more information, download the 3DASIP2016 Sponsorship form. 7700 South River Parkway. Tempe, AZ 85284. Corona, CA 92880-5409. Tel: 1 951 817 3700. Fax: 1 951 817 0640. 2045 E. Innovation Circle. Tempe, AZ 85284. Join Our Mailing List. Speakers – Conference. Speakers – Tutorial.