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PITek Basis of Particle Interconnect Technology

Basis of Particle Interconnect technology. Particle Interconnect" (PI) overview. Controlled impedance to lead of package / die pad. SEM, FIB, AFM pictures of metal. SEM pictures of Particle Interconnect. Optical Microscope pictures of PI. Standard wiping contact spalling. TDR, S parameter, Eye diagrams. Close-up of Particle Interconnect pads shows controlled stacking of particles to a desired height with clearance between individual particles. Particle Interconnect" (PI) overview. Eliminating wirebonding...

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PITek Basis of Particle Interconnect Technology | pitek.us Reviews

<META> DESCRIPTION

Basis of Particle Interconnect technology. Particle Interconnect (PI) overview. Controlled impedance to lead of package / die pad. SEM, FIB, AFM pictures of metal. SEM pictures of Particle Interconnect. Optical Microscope pictures of PI. Standard wiping contact spalling. TDR, S parameter, Eye diagrams. Close-up of Particle Interconnect pads shows controlled stacking of particles to a desired height with clearance between individual particles. Particle Interconnect (PI) overview. Eliminating wirebonding...

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1 features comparison

2 applications

3 sample products

4 fem analysis

5 test results

6 bandwidth 100 ghz

7 or sip

8 usage

9 emulation

10 characterization

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features comparison,applications,sample products,fem analysis,test results,bandwidth 100 ghz,or sip,usage,emulation,characterization,field replacable,and production,and test fixtures,features,gas tight oxide penetrating connection,physical description

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PITek Basis of Particle Interconnect Technology | pitek.us Reviews

https://pitek.us

Basis of Particle Interconnect technology. Particle Interconnect" (PI) overview. Controlled impedance to lead of package / die pad. SEM, FIB, AFM pictures of metal. SEM pictures of Particle Interconnect. Optical Microscope pictures of PI. Standard wiping contact spalling. TDR, S parameter, Eye diagrams. Close-up of Particle Interconnect pads shows controlled stacking of particles to a desired height with clearance between individual particles. Particle Interconnect" (PI) overview. Eliminating wirebonding...

INTERNAL PAGES

pitek.us

1

PITek Emulation Socket

http://www.pitek.us/EmulationSockets.html

Testing bumped chip on Particle Interconnect leadframe. Alternative Particle Interconnect lead frame with holddown. Removable single unit - proof of concept. 0025" pitch, 196 lead, ceramic QFP. 0020" pitch, 256 lead, ceramic QFP. Field replacable socket vs. nonfield replacable packages. Field replacable socket diagram. Field replacable socket contact resistance. Contact resistance vs current capacity. 0020" pitch connection. Accuracy:. Current source: ± 0.1 milli-A, 5 digit resolution. Too small to read.

2

PITek Particle Interconnect Papers

http://www.pitek.us/MMSpapers.html

Particle Interconnect - MMS Spectrum MCM announcement. Chip makers try to add quality while removing the package. Particle Interconnect - MMS Known-Good-Die/Chip Scale Package. Particle Interconnect - MMS reworking multichip modules. Particle Interconnect - MMS - TI - HP bare die probe. Particle Interconnect - MMS - Intel Known-Good-Die probe/burn-in. Particle Interconnect - MMS - TI Known-Good-Die. Particle Interconnect - MMS Spectrum MCM announcement. For Dell laptop usage. MCM Packs A Portable Punch.

3

PITek Standard Wiping Contact Spalling

http://www.pitek.us/StandardWiping.html

Standard Wiping Contact Spalling. Standard wiping contact cross section after spalling. Metal removed by wiping. Standard wiping contact cross section without spalling. Contact resistance (milli-Ohm) vs. holddown force (gram-force). 025" diameter hemispherical probes vs. 63/37 tin-lead coated surface. Bright tin probe vs. control (no PI). Bright tin probe vs. 20-25 μ PI. 0010" BeCu, 0.250" Ni, 0.150" SnPb. 20 to 80,000 milli-Ohms, 1 to 9 remates. 0010" BeCu, 0.250" Ni PI, 0.150" SnPb.

4

PITek Scanning Electron Microscope

http://www.pitek.us/PI-SEM.html

Scanning Electron Microscope pictures of PI. Examination of particle uniformity. 6-12 μ particles coated with Ni and Cu, and pressed onto Cu. SEM at 1090x magnification, 60 degree angle. SEM's of contact surface. Tin-Lead solder over Nickel coated particles. 22x magnification with 88x zoom view. SEM of pad probed by Particle Interconnect rigid socket. Surface of PLCC J-Lead after 30,000 insertions. Surface finish of lead passed steam aging test.

5

PITek Test Results

http://www.pitek.us/Test.html

Lifetest comparison of Particle Interconnect vs. commonly available sockets. Contact resistance (milli-Ohm) vs. holddown force (gram-force). Battery discharge rate [0.200 Amp]. Particle Interconnect bare board membrane test fixture test results. Test results for Particle Interconnect to punch through adhesive film. MIL-STD-810F summary for Particle Interconnect. SEM, FIB, AFM pictures of metal. Scanning electron microscope pictures of PI. Optical microscope pictures of PI. Standard wiping contact spalling.

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PITek Basis of Particle Interconnect Technology

Basis of Particle Interconnect technology. Particle Interconnect" (PI) overview. Controlled impedance to lead of package / die pad. SEM, FIB, AFM pictures of metal. SEM pictures of Particle Interconnect. Optical Microscope pictures of PI. Standard wiping contact spalling. TDR, S parameter, Eye diagrams. Close-up of Particle Interconnect pads shows controlled stacking of particles to a desired height with clearance between individual particles. Particle Interconnect" (PI) overview. Eliminating wirebonding...

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