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Reliability Engineering

Lexicon of Semiconductor Terms. Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs). Tech Brief tb363.2). Guidelines for Soldering Surface Mount Components to PC Boards. Tech Brief tb334.2). Decreasing Moisture Content of Epoxy. Calculation of Semiconductor Failure Rates. Reliability Considerations for Using Plastic Encapsulated Microcircuits in Military Applications. Use of Life Tested Parts. Estimated Failure Rates for Class T Products.

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Lexicon of Semiconductor Terms. Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs). Tech Brief tb363.2). Guidelines for Soldering Surface Mount Components to PC Boards. Tech Brief tb334.2). Decreasing Moisture Content of Epoxy. Calculation of Semiconductor Failure Rates. Reliability Considerations for Using Plastic Encapsulated Microcircuits in Military Applications. Use of Life Tested Parts. Estimated Failure Rates for Class T Products.
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Reliability Engineering | rel.intersil.com Reviews

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Lexicon of Semiconductor Terms. Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs). Tech Brief tb363.2). Guidelines for Soldering Surface Mount Components to PC Boards. Tech Brief tb334.2). Decreasing Moisture Content of Epoxy. Calculation of Semiconductor Failure Rates. Reliability Considerations for Using Plastic Encapsulated Microcircuits in Military Applications. Use of Life Tested Parts. Estimated Failure Rates for Class T Products.

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PEM Whitepaper

http://rel.intersil.com/docs/rel/PEM/index.html

RELIABILITY CONSIDERATIONS FOR USING PLASTIC-ENCAPSULATED. MICROCIRCUITS IN MILITARY APPLICATIONS. William L. Schultz and Sheldon Gottesfeld. Download a printer-friendly PDF version. ADVANTAGES AND LIMITATIONS OF PEMs. FAILURE MECHANISMS OF PEMs AND HSMs. COMPARISON OF PLASTIC AND HERMETIC RELIABILITY DATA. APPLICATIONS ENVELOPE FOR PEMs. BEST PRACTICES FOR DESIGNING IN QUALITY AND RELIABILITY. BEST PRACTICES RECOMMENDED FOR PRODUCT HANDLING AND PROCESSING. Mil Plastic - 30 AUG 94.

2

ESTIMATED FAILURE RATES FOR CLASS T PRODUCTS

http://rel.intersil.com/reports/class_t_failure_rates.html

ESTIMATED FAILURE RATES FOR CLASS T PRODUCTS. 10 um CMOS DI. 4 um Si Gate DI CMOS. FIT rates are estimated from calendar year 1997 CLASS V actuals by multiplying by 2.

3

Reliability Engineering

http://rel.intersil.com/docs/lexicon/index.html

Lexicon of Semiconductor Terms. Very industry, as it grows and matures, develops its own language for explaining concepts that are unique to its endeavors. In high-technology industries, language has special meaning for its users and becomes a convenient tool for referring to programs, processes, products or technologies that can be extremely complex. We hope you find this lexicon useful, and we welcome suggestions for making it, and our products, even more useful in the future.

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Reliability Engineering

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Sign up for new course alerts and special offers! Approved by the Ohio State Board of Career Colleges and Schools to offer postsecondary programs of electronics technology, computer technology and electronic engineering technology. Registration Certificate 70-11-0002H. View the current course catalog online. Cleveland Institute of Electronics' course catalog is available online here. Alpha Beta Kappa Honorary Society. See the list of recent CIE students inductees here. Hundreds of books covering computer...

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Reliability Engineering

Lexicon of Semiconductor Terms. Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs). Tech Brief tb363.2). Guidelines for Soldering Surface Mount Components to PC Boards. Tech Brief tb334.2). Decreasing Moisture Content of Epoxy. Calculation of Semiconductor Failure Rates. Reliability Considerations for Using Plastic Encapsulated Microcircuits in Military Applications. Use of Life Tested Parts. Estimated Failure Rates for Class T Products.

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