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Semimap COREMA Contactless Resistivity Mapping for GaAs and SiC

Homepage Semimap Scientific Instruments GmbH develops measurement systems for to evaluate electrical properties of semi-insulating compound semiconductor substrates. COREMA-WT, COREMA-RM and CORMA-VT characterize substrate properties with respect to resistivity, mobility and carrier concentration for GaAs, InP, SiC, GaN and CdTe

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Semimap COREMA Contactless Resistivity Mapping for GaAs and SiC | semimap.de Reviews
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Homepage Semimap Scientific Instruments GmbH develops measurement systems for to evaluate electrical properties of semi-insulating compound semiconductor substrates. COREMA-WT, COREMA-RM and CORMA-VT characterize substrate properties with respect to resistivity, mobility and carrier concentration for GaAs, InP, SiC, GaN and CdTe
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1 Semimap GmbH
2 COREMA-WT
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Semimap COREMA Contactless Resistivity Mapping for GaAs and SiC | semimap.de Reviews

https://semimap.de

Homepage Semimap Scientific Instruments GmbH develops measurement systems for to evaluate electrical properties of semi-insulating compound semiconductor substrates. COREMA-WT, COREMA-RM and CORMA-VT characterize substrate properties with respect to resistivity, mobility and carrier concentration for GaAs, InP, SiC, GaN and CdTe

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1

Semimap COREMA Contactless Resistivity Mapping for GaAs and SiC

http://www.semimap.de/index.htm

SemiMap Scientific Instruments GmbH develops measurement systems to evaluate electrical properties of semi-insulating compound semiconductor substrates. GaAs, InP, SiC, GaN and CdTe. Are chearacterized by SemiMap systems with respect to resistivity, mobility and carrier concentration. The non-destrucive contactless capacitive measurement technique requires no sample preparation and generates full wafer resistivity topograms revealing lateral variations as small as 1% with high lateral resolution.

2

Semimap Forum

http://www.semimap.de/Semimap_forum.htm

Related papers by collaborating authors and other groups:. PVT Growth of p-Type and Semi-Insulating 2-Inch 6H-SiC Crystals. Rasp, Th.L. Straubinger, E. Schmitt, M. Bickermann, S. Reshanov and H. Sadowski,. Mat Science Forum 433-436 (2003) 55. Development of Large Diameter High-Purity Semi-insulating 4H-SiC Wafers for Microwave Devices. IF you have questions or comments, please send your E-mail to: info@semimap.de.

3

Semimap Mission

http://www.semimap.de/Semimap_mission.htm

Company Background and Mission. The rapid growth of the telecommunications market has dramatically increased the demand for high-speed analog and digital microelectronic devices. Such circuits are preferentially fabricated on substrates with high electrical resistivity. Therefore, sales of semi-insulating GaAs, InP. And SiC wafers are growing rapidly. Concurrently, steady improvements of the crystal growth and wafer fabrication technologies yield better material quality and increased wafer diameters.

4

Semimap Presentation

http://www.semimap.de/Semimap_presentation.htm

GaAs MANTECH 2002, Miami Beach, USA. 3, Erlangen, Germany. S-MAX 2004, Monterey, USA. MANTECH 2005, San Diego, USA. 2007, Oton, Japan. 2008, Barcelona, Spain [PDF]. IF you have questions or comments, please send your E-mail to: info@semimap.de.

5

Semimap Publications

http://www.semimap.de/Semimap_publications.htm

Basic papers and overview reports:. Contactless evaluation of semi-insulating GaAs wafer resistivity using the time-dependent charge measurement. R Stibal, J. Windscheif and W. Jantz, Semicond. Sci. Technol. 6 (1991) 955. Contactless resistivity mapping of semi-insulating substrates. W Jantz and R. Stibal, III-Vs Review 6 (1993) 382. Quality assessment of LEC grown semi-insulating GaAs substrates. W Jantz, dgkk Mitteilungsblatt 54 (1991) 19. Global standardization of compound semiconductor test methods.

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Semimap COREMA Contactless Resistivity Mapping for GaAs and SiC

SemiMap Scientific Instruments GmbH develops measurement systems to evaluate electrical properties of semi-insulating compound semiconductor substrates. GaAs, InP, SiC, GaN and CdTe. Are chearacterized by SemiMap systems with respect to resistivity, mobility and carrier concentration. The non-destrucive contactless capacitive measurement technique requires no sample preparation and generates full wafer resistivity topograms revealing lateral variations as small as 1% with high lateral resolution.

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