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Sherlock Tools Catalog

Fatigue of solder joints under Leadless Chip Components (LCC), such as chip resistors and capacitors, can influence long-term reliability of electronic products operating in environments with temperature cycling. This model allows the user to predict the lifetime of leadless chip components accounting for solder alloy (Sn63Pb37 or SAC305), Printed Circuit Board (PCB) material, and use environment. The calculations are performed using a strain energy based model developed by DfR Solutions. Correlates ther...

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Sherlock Tools Catalog | sherlock.dfrsolutions.com Reviews

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Fatigue of solder joints under Leadless Chip Components (LCC), such as chip resistors and capacitors, can influence long-term reliability of electronic products operating in environments with temperature cycling. This model allows the user to predict the lifetime of leadless chip components accounting for solder alloy (Sn63Pb37 or SAC305), Printed Circuit Board (PCB) material, and use environment. The calculations are performed using a strain energy based model developed by DfR Solutions. Correlates ther...

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Sherlock Tools Catalog | sherlock.dfrsolutions.com Reviews

https://sherlock.dfrsolutions.com

Fatigue of solder joints under Leadless Chip Components (LCC), such as chip resistors and capacitors, can influence long-term reliability of electronic products operating in environments with temperature cycling. This model allows the user to predict the lifetime of leadless chip components accounting for solder alloy (Sn63Pb37 or SAC305), Printed Circuit Board (PCB) material, and use environment. The calculations are performed using a strain energy based model developed by DfR Solutions. Correlates ther...

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dfrsolutions.com

Automate Reliability Prediction Using Physics of FailureDfR Solutions

http://www.dfrsolutions.com/software/see-how-sherlock-works

Send Us an Email. Electronic Component Counterfeit Detection. Electronics Design Reliability References. See How Sherlock Works. The Future of Design. Physics of Failure Based Design Analysis. Improve your Existing MTBF Calculations. Pass Your Electronics Testing Standards. Satisfy GMW 3172 Analysis Requirements. Solve Solder Reliability and Improve Product Performance. Speed Up your Finite Element Analysis. Automate Reliability Prediction Using Physics of Failure. Phase 1: Data Input.

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Send Us an Email. Electronic Component Counterfeit Detection. Electronics Design Reliability References. Failure Modes and Effects Analysis. Finite Element Analysis – Mechanical Simulation. Semiconductor Packaging and Assembly. Printed Circuit Board/ Bare Board Vendor. Circuit Card Assembly/Contract Assembler. Material Testing and Qualification. Component Testing and Qualification. Product Testing and Validation. Electronics Packaging Failure Analysis. Solder Joint Failure Analysis. Unrivaled capabilitie...

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Chip Capacitor Flex CrackingDfR Solutions

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Send Us an Email. Electronic Component Counterfeit Detection. Electronics Design Reliability References. Plated Through Hole (PTH) Fatigue. Intermetallic Growth Due to Thermal Aging. Thermal Cycling to Service Life Correlation. Electronics Manufacturing Unit Conversion. Chip Capacitor Flex Cracking.

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Electronics Design Manufacturing Reliability TrainingDfR Solutions

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Send Us an Email. Electronic Component Counterfeit Detection. Electronics Design Reliability References. Failure Modes and Effects Analysis. Finite Element Analysis – Mechanical Simulation. Semiconductor Packaging and Assembly. Printed Circuit Board/ Bare Board Vendor. Circuit Card Assembly/Contract Assembler. Material Testing and Qualification. Component Testing and Qualification. Product Testing and Validation. Electronics Packaging Failure Analysis. Solder Joint Failure Analysis. Is filled with intere...

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Sherlock Free Trial - DfR SolutionsDfR Solutions

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Send Us an Email. Electronic Component Counterfeit Detection. Electronics Design Reliability References. See How Sherlock Works. The Future of Design. Physics of Failure Based Design Analysis. Improve your Existing MTBF Calculations. Pass Your Electronics Testing Standards. Satisfy GMW 3172 Analysis Requirements. Solve Solder Reliability and Improve Product Performance. Speed Up your Finite Element Analysis. Sherlock Automated Design Analysis Software Free Trial. Clearly design for manufacturability.

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Send Us an Email. Electronic Component Counterfeit Detection. Electronics Design Reliability References. See How Sherlock Works. The Future of Design. Physics of Failure Based Design Analysis. Improve your Existing MTBF Calculations. Pass Your Electronics Testing Standards. Satisfy GMW 3172 Analysis Requirements. Solve Solder Reliability and Improve Product Performance. Speed Up your Finite Element Analysis. Physics of Failure Based Design Analysis. Improve your existing MTBF Calculations.

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Electronics Manufacturing Test Plan Development ServicesDfR Solutions

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Send Us an Email. Electronic Component Counterfeit Detection. Electronics Design Reliability References. Failure Modes and Effects Analysis. Finite Element Analysis – Mechanical Simulation. Semiconductor Packaging and Assembly. Printed Circuit Board/ Bare Board Vendor. Circuit Card Assembly/Contract Assembler. Material Testing and Qualification. Component Testing and Qualification. Product Testing and Validation. Electronics Packaging Failure Analysis. Solder Joint Failure Analysis. With deep knowledge o...

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Circuit Board Design Software | Electronics Design Reliability PredictionDfR Solutions

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Send Us an Email. Electronic Component Counterfeit Detection. Electronics Design Reliability References. See How Sherlock Works. The Future of Design. Physics of Failure Based Design Analysis. Improve your Existing MTBF Calculations. Pass Your Electronics Testing Standards. Satisfy GMW 3172 Analysis Requirements. Solve Solder Reliability and Improve Product Performance. Speed Up your Finite Element Analysis. Circuit Board Design Software. Wouldn’t it be nice to see into the future? Easy to deploy and use.

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Send Us an Email. Electronic Component Counterfeit Detection. Electronics Design Reliability References. See How Sherlock Works. The Future of Design. Physics of Failure Based Design Analysis. Improve your Existing MTBF Calculations. Pass Your Electronics Testing Standards. Satisfy GMW 3172 Analysis Requirements. Solve Solder Reliability and Improve Product Performance. Speed Up your Finite Element Analysis. Visit the Sherlock Automated Design Analysis Software Users Forum. Visit the Sherlock User Forum.

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How to choose electronics manufacturing suppliersDfR Solutions

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Send Us an Email. Electronic Component Counterfeit Detection. Electronics Design Reliability References. Failure Modes and Effects Analysis. Finite Element Analysis – Mechanical Simulation. Semiconductor Packaging and Assembly. Printed Circuit Board/ Bare Board Vendor. Circuit Card Assembly/Contract Assembler. Material Testing and Qualification. Component Testing and Qualification. Product Testing and Validation. Electronics Packaging Failure Analysis. Solder Joint Failure Analysis. DfR Solutions is in t...

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Sherlock Tools Catalog

Fatigue of solder joints under Leadless Chip Components (LCC), such as chip resistors and capacitors, can influence long-term reliability of electronic products operating in environments with temperature cycling. This model allows the user to predict the lifetime of leadless chip components accounting for solder alloy (Sn63Pb37 or SAC305), Printed Circuit Board (PCB) material, and use environment. The calculations are performed using a strain energy based model developed by DfR Solutions. Correlates ther...

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