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EPTC 2016 Abstracts SubmissionEPTC 2016 Abstracts Submission
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EPTC 2016 Abstracts Submission
About EPTC – Electronics Packaging Technology Conference
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Electronics Packaging Technology Conference. 18th Electronics Packaging Technology Conference, 30th Nov – 3rd Dec 2016, Suntec Singapore Convention and Exhibition Center. Kenji Otsuka: How to Feed Enough to Greedy IoT Monster. James Morris: Nanotechnologies for Microelectronics Packaging Applications. Ingrid De Wolf: 3D Failure Analysis. Albert Lan: Fan-In and Fan-Out in Wafer Level Packaging. Yogendra Joshi: Energy Efficient Thermal Management of Data Centers. Andreas Fischer: Automotive Packaging.
SPONSORS – Electronics Packaging Technology Conference
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Electronics Packaging Technology Conference. 18th Electronics Packaging Technology Conference, 30th Nov – 3rd Dec 2016, Suntec Singapore Convention and Exhibition Center. Kenji Otsuka: How to Feed Enough to Greedy IoT Monster. James Morris: Nanotechnologies for Microelectronics Packaging Applications. Ingrid De Wolf: 3D Failure Analysis. Albert Lan: Fan-In and Fan-Out in Wafer Level Packaging. Yogendra Joshi: Energy Efficient Thermal Management of Data Centers. Andreas Fischer: Automotive Packaging.
COMING SOON! – Electronics Packaging Technology Conference
https://eptc-ieee.net/coming_soon.html
Electronics Packaging Technology Conference. 18th Electronics Packaging Technology Conference, 30th Nov – 3rd Dec 2016, Suntec Singapore Convention and Exhibition Center. Kenji Otsuka: How to Feed Enough to Greedy IoT Monster. James Morris: Nanotechnologies for Microelectronics Packaging Applications. Ingrid De Wolf: 3D Failure Analysis. Albert Lan: Fan-In and Fan-Out in Wafer Level Packaging. Yogendra Joshi: Energy Efficient Thermal Management of Data Centers. Andreas Fischer: Automotive Packaging.
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EPTC 2016 Abstracts Submission
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