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Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film / Thin Film Substrate Fabrication. | Tong Hsing Electronic Industries, Ltd.

The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.. Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, military, computer peripherals, medical and network equipment.

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Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film / Thin Film Substrate Fabrication. | Tong Hsing Electronic Industries, Ltd. | theil.com Reviews

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The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.. Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, military, computer peripherals, medical and network equipment.

<META> KEYWORDS

1 DBC

2 CMOS Image Sensor

3 Image Sensor

4 BSI wafer

5 SiP

6 MEMS assembling and test

7 Power Module

8 Microwave Module

9 RF module

10 and DPC on AlN for Thermoelectric Module

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language »,english,中文繁體,中文简体,management,technology,quality management,corporate social responsibility,award,branch,video,available substrate technologies,assembly packaging services,rf testing,news,application,automotive hybrids,vcsel,dbc substrate

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Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film / Thin Film Substrate Fabrication. | Tong Hsing Electronic Industries, Ltd. | theil.com Reviews

https://theil.com

The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.. Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, military, computer peripherals, medical and network equipment.

INTERNAL PAGES

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Substrate Manufacturing Services – Direct Bonded Copper(DBC) - Taiwan high quality Substrate Manufacturing Services – Direct Bonded Copper(DBC) manufacturer | Tong Hsing Electronic Industries, Ltd.

http://www.theil.com/en/category/Substrate-Manufacturing-Services-Direct-Bonded-CopperDBC/A01.html

Substrate Manufacturing Services Direct Bonded Copper(DBC). Substrate Manufacturing Services Direct Bonded Copper(DBC). Substrate Manufacturing Services Direct Plated Copper(DPC). Substrate Manufacturing Services - Thick Film Substrate. Available Microelectronic Packaging Technologies. Backend Technology and Others. Raquo; Substrate Manufacturing Services Direct Bonded Copper(DBC). Substrate Manufacturing Services Direct Bonded Copper(DBC). 2 High-Frequency Switching Power Supply. 5 Solar Cell Component.

2

Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film / Thin Film Substrate Fabrication. | Tong Hsing Electronic Industries, Ltd.

http://www.theil.com/en/index/index.html

Tong Hsing Electronic Industries, Ltd. Substrate Manufacturing Services Direct Bonded Copper(DBC). Substrate Manufacturing Services Direct Plated Copper(DPC). Substrate Manufacturing Services - Thick Film Substrate. Available Microelectronic Packaging Technologies. Backend Technology and Others. Microelectronic / Image Sensor Assembly. DPC / DBC substrate. Welcome to Tong Hsing Electronic Industries, Ltd. Custom specilized Assembly Package. RF Module, SiP, MEMS,. CMOS Image Sensor,. Medical, Aerospace,.

3

同欣电子- 多晶模组封装之领导厂商 | 同欣電子工業股份有限公司

http://www.theil.com/zh-CN/index/index.html

同欣电子所研发生产的直接电镀铜(DPC)与直接覆铜(DBC)陶瓷电路基板具有: 1.薄膜制程，让基本上的线路更加精确 (2)量大降低成本 (3)可塑性高，可依合作伙伴的不同需求做设计。同欣電子工業股份有限公司 -影像产品封装,多重晶片模组,厚膜混合积体电路模组,印刷电路板组装,高频无线通讯模组构装,汽车及医疗电子产品,通讯产品之模组构装, 厚膜印刷电路板, 直接电镀铜DPC陶瓷电路板, 直接覆铜DBC陶瓷电路板制造, 高亮度LED散热基版, 超高亮度LED构装, 系统整合构装, 微机电封装,高功率模组封装. 同欣電子工業股份有限公司专精于影像产品封装,多重晶片模组,厚膜混合积体电路模组,印刷电路板组装,高频无线通讯模组构装,汽车及医疗电子产品,通讯产品之模组构装, 厚膜印刷电路板, 直接电镀铜DPC陶瓷电路板, 直接覆铜DBC陶瓷电路板制造, 高亮度LED散热基版, 超高亮度LED构装, 系统整合构装, 微机电封装, 高功率模组封装。 TEL: 886-2-26790122 分機 1022 或 1903. FAX: 886-2-26791211 分機 1022 或 1903.

4

RF Testing - Taiwan high quality RF Testing manufacturer | Tong Hsing Electronic Industries, Ltd.

http://www.theil.com/en/category/RF-Testing/B03.html

Substrate Manufacturing Services Direct Bonded Copper(DBC). Substrate Manufacturing Services Direct Plated Copper(DPC). Substrate Manufacturing Services - Thick Film Substrate. Available Microelectronic Packaging Technologies. Backend Technology and Others. Raquo; RF Testing. RF Testing - RF Testing Partners. We offer operations and sustaining engineering support for customer consigned RF testers. Backend Technology and Others. Substrate Manufacturing Services - Thin Film Substrate(DPC). View More ».

5

Tong Hsing Electronic Industries, Ltd. | Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film / Thin Film Substrate Fabrication.

http://www.theil.com/en/branch/index.html

Tong Hsing Electronic Industries, Ltd. Substrate Manufacturing Services Direct Bonded Copper(DBC). Substrate Manufacturing Services Direct Plated Copper(DPC). Substrate Manufacturing Services - Thick Film Substrate. Available Microelectronic Packaging Technologies. Backend Technology and Others. Address: 6th Floor, 83, Yenping South Road, Taipei, Taiwan. Address: Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24 57.733'/E121 19.862'). Tong Hsing Electronics (Phils), Inc.

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juderich.com

judeRich裘富 insider - Page 2 of 29 - 無形投資理財、新興產業筆記，是有形財富、股市的土壤

http://www.juderich.com/page/2

2016 年 05 月 09 日. 3450 的近況又是如何聯鈞 LTE需求增，抵銷PON跌價壓力明年光資訊嶄露頭角聯鈞光電的營運來源有聯鈞本身、子公司F-捷敏 6525 與合鈞科技等3部份，且光是聯鈞本身的產品線也可分為光通訊. 3450 聯鈞光電 2016(f) 2016-05-09. 警語 2Q 4Q 2016的財務數字預估，係由公司展望作出修訂對公司日後展望看法，是主觀上的判斷，並不保證預測的正確性、幾乎可確定日後一定會再作修正。 2016 年 05 月 07 日. 1Q營收季增1.2%，優於預期原估季減個位數，動力是 LED陶瓷基板. 之前投資法人報告，第2季營收就要達20億元例如20.5億估全年毛利率達26%以上，但是2Q營收成長估僅成長1 2%，營收成長速度稍慢，毛利率要見到27%與26.5%要等3Q、4Q，全年應不到26%，這與市場預估大致相近。同欣電 6271 2016(F) 2016-05-07. 警語 2Q 4Q 2016的財務數字預估，係由公司說法作出修訂對公司的日後展望看法，是主觀上的判斷，並不保證預測的正確性、幾乎可確定日後一定會再作修正。智邦明泰 ...

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Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film / Thin Film Substrate Fabrication. | Tong Hsing Electronic Industries, Ltd.

Tong Hsing Electronic Industries, Ltd. Substrate Manufacturing Services Direct Bonded Copper(DBC). Substrate Manufacturing Services Direct Plated Copper(DPC). Substrate Manufacturing Services - Thick Film Substrate. Available Microelectronic Packaging Technologies. Backend Technology and Others. Microelectronic / Image Sensor Assembly. DPC / DBC substrate. Welcome to Tong Hsing Electronic Industries, Ltd. Custom specilized Assembly Package. RF Module, SiP, MEMS,. CMOS Image Sensor,. Medical, Aerospace,.

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Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film / Thin Film Substrate Fabrication. | Tong Hsing Electronic Industries, Ltd.

Tong Hsing Electronic Industries, Ltd. Substrate Manufacturing Services Direct Bonded Copper(DBC). Substrate Manufacturing Services Direct Plated Copper(DPC). Substrate Manufacturing Services - Thick Film Substrate. Available Microelectronic Packaging Technologies. Backend Technology and Others. Microelectronic / Image Sensor Assembly. DPC / DBC substrate. Welcome to Tong Hsing Electronic Industries, Ltd. Custom specilized Assembly Package. RF Module, SiP, MEMS,. CMOS Image Sensor,. Medical, Aerospace,.

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